|
|
|
Model |
Wafer |
CP Flow Control Chart |
|
Dept. |
QRA |
|
Symbol |
□: Operation ◇:Inspection↑↓:Move |
|
Item |
Process Flow |
Process |
Control Point |
|
1 |
|
Supplier |
Quantity check |
|
2 |
Store |
1. Quantity check |
|
2. type No. check |
|
3. Batch No. check |
|
3 |
Incoming Inspection |
1. Quantity check |
|
2. type No. check |
|
3. Spec verify |
|
4 |
CP Elec. Functional Test |
1. Elec. Spec. verify |
|
2. Program check |
|
3. Yield control |
|
|
|
|
5 |
INK |
1. Ink viscosity check |
|
2. Ink mark spec. verify |
|
6 |
QC Visual Inspection |
1. Ink mark spec. verify |
|
2. Appearance |
|
7 |
Baking |
1. Pre-heating 20 min. |
|
2. Heating 30 min. Keep 125*C |
|
3. Reduce heating 30 min. |
|
8 |
QC Visual Inspection |
1. Ink mark spec. verify. |
|
2. CP spec. verify |
|
9 |
Packing |
1. Quantity/ type/label check |
|
2. Lot No. /appearance check |
|
10 |
OQA Visual Inspection |
1. Quantity/ type/label check2. Lot No./appearance check |
|
11 |
Store |
1. Quantity/ type/label check |
|
2. Lot No. /appearance/P.O. check |
|
|
|
|
12 |
Supplier |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
