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Procedure to Create UF200 New Device

时间:2014-08-19 20:52来源:www.ictest8.com 作者:ictest8 点击:
1) Creating the device parameter
Create each set up elements such as device name, wafer size, XY indexing size, OF direction, chuck temperature, multi measuring and needle height of the card.
2) Setting of operation parameter
Set up needle position alignment (manual), needle height (manual) and standard of XY coordinator.
3) Stop prober before probing and load the wafer. Measure the center of wafer thickness automatically.
4) Alignment Registration
Register the street junction,

 
Select alignment references at low and high magnification.
The points to select the reference
Pattern which has clear contrast
Place where vertical and horizontal lines are clear
Unique location
Do not register when there is a TEG in a street, or do not register the TEG die.
Avoid the pad, which is for high magnification only.
(It starts the alignment automatically when the registration completes)
4) Pad Registration 

  Register 16~20 corner pads in total.
                                                                                                 
 (It starts needle alignment automatically when the pad registration completes)
5) Create and revise the map (Able to revise by comparing with the image of the chip)
6) Save newly created device to HD
Continue to make sure contact height >>  Start probing
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