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UF200 probe技术资料

时间:2012-05-21 19:38来源:www.ictest8.com 作者:ictest8 点击:

- CONTENTS -
1 Introduction.................................................................................... 1
2 Features ........................................................................................ 2
3 Main Units ..................................................................................... 4
4 General Specifications and Requirements.................................... 5
5 Units Specifications....................................................................... 7
6 Featuring Functions..................................................................... 10
7 Main Optional Functions.............................................................. 12
8 Specifications of Standard Tester Interface ................................ 13
9 Delivery Specifications ................................................................ 15
10 External View ............................................................................ 19

1 Introduction
Automatic Wafer Probing Machine UF200 is a prober for LSI and VLSI wafers designed to
meet:
Large size wafer handling capability (upto φ200 mm, 8" wafers)
Enhanced automation toward operation with no aids of operator
Clean machine
Highly accurate probing
High reliability of ITV fine alignment
Very rigid Chuck mechanism allowing high-count multi-site probing
2 Features
(1) Highly accurate prober having the total positioning accuracy of 4 μm over X/Y axes.
The scales attached along the X/Y axes traveling directions are read and referenced in the
final step of positioning, ensuring the Chuck positioning accuracy.
The X/Y axes are controlled in the graduation 0.5 μm, and their maximum speed is 200
mm/sec; these accurate control and high speed greatly contribute to the enhancement of
reliability and throughput.
(2) Very rigid Chuck Z/q stage to enable high-count multi-site probing in a good stability
The well recognized Z/q stage rigidity is made much stronger to meet the need of future
multi-site probing.
(3) In order to reduce the operator's work load, the automatic setup function including the
automatic probe-pad alignment function is provided (the automatic probe-pad alignment
function is option).
An independent optical system is used so that many probe tips can land on their
corresponding pads automatically and precisely.
(4) User-friendly prober for much easier operation.

A color LCD with touch panel is used for the display and operation.
The content of display and corresponding touch switches are automatically changed
according to each operation step and condition, helping the operator from wrong operations
and making the complicated functions easier to use.
(5) Wafer transfer in a more clean condition.
(6) Data such as device parameters and running status information can be freely sent or
received to or from the hard disk, floppy disk, and an external computer system.
The floppy disk uses the MS-DOS format, making easier the data handling with a personal
computer system.
(7) Universal HF test head manipulators are optionally available which are well designed so as
to mount and handle various makers' high frequency test heads.
(8) Semi-automatic probe-card change. (Option)
(9) In an automated production line, direct communication is possible with a wafer transfer
controlling computer or host computer to build up an automated system. (Option)
(10) The wafer ID recognition function of high recognition ability is optionally available for the
purpose of wafer management or automatic setup of device parameters (with an optional
software function).
(11) The standard bus configuration is used for a better system expandability.
Various communication functions can be implemented by simply adding necessary boards
without any loss of the throughput.
(12) A 32-bit CPU and a distributed data processing architecture ensure the software
extendibility. An ample memory space offers a capability of various function addition.
Note: The above description includes performance of the optional functions.
3 Main Units
The standard composition is as follows:
(1) Wafer chuck (Chuck)
(2) Loader unit (including mechanisms of one elevator, prealignment stage and wafer transfer
sub-units and their interfaces)
(3) Fine alignment unit
(4) Displacement sensor

 

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另外,由于篇幅较大,本站推出如下详细资料,敬请下载参考!
UF200 SPECIFICATIONS

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